BHUBANESWAR: Taking a major leap in its semiconductor ecosystem ambitions, the state government on Sunday laid the foundation stone for the country’s first advanced 3D chip packaging unit at Infovalley-II in the city.
The Heterogeneous Integration Packaging Solutions project, promoted by 3D Glass Solutions, was grounded in the presence of Chief Minister Mohan Charan Majhi and Union Electronics and IT minister Ashwini Vaishnaw. The facility will bring cutting-edge 3D glass substrate packaging technology to India for the first time.
Calling it a historic milestone, the chief minister said the project marks Odisha’s transition from a resource-based economy to technology driven growth hub. He said the association of the global technology majors such as Intel, Lockheed Martin and Applied Materials with the advanced packaging ecosystem signals strong global interest in Odisha.
With an investment of nearly Rs 2,000 crore, including Rs 799 crore in central support and around Rs 399.5 crore from the state, the facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3D heterogeneous integration modules. Commercial production is slated to begin by August 2028, with full-scale operations targeted by 2030.
Majhi asserted that the state is rapidly emerging as a preferred destination for investors. It has already attracted semiconductor investments worth over Rs 10,000 crore with companies like RIR Power Electronics and SiCSEM establishing a presence here. The chief minister said the products manufactured in the state will support next-generation sectors such as AI, high-performance computing, defence electronics, telecommunications and advanced digital systems.
“Odisha is ready to play a pivotal role in realising Prime Minister Narendra Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing,” he added.
Calling upon the youth, the chief minister urged students and engineers to build careers in emerging technology sectors. “Odisha is your destination for the future,” he said.
Vaishnaw said Odisha is entering a new era of development, driven by strong leadership and a clear focus on industrial growth and employment generation. Glass substrate packaging technology represents the future of semiconductor manufacturing. The unit’s products would be the first-of-the-kind in India, he said.
He said India’s electronics manufacturing has expanded six-fold over the past 12 years, with the country emerging as the world’s second-largest mobile phone producer and a leading exporter in 2025. “Odisha is increasingly becoming central to this transformation, with multiple semiconductor projects approved under the India Semiconductor Mission and more proposals in the pipeline,” he added.
Joining the event on virtual mode, Intel CEO Lip-Bu Tan expressed his gratitude to Majhi for his proactive support and partnership in enabling the project.
State Electronics & IT minister Mukesh Mahaling, chief secretary Anu Garg, senior officials and industry representatives were present at the event.